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Resino Heads to PACK EXPO

Attendees can get answers to questions right on the spot and learn how Resino may support them to drive business forward.

By: Rachel Revitch

, Rodman Media

Resino Printing Inks invites attendees to join them for free at PACK EXPO on Sept. 27-29 in Las Vegas PACK EXPO is a trade event which presents processing and packaging innovation, and you can gain insights into the latest technologies in the industry. To get free registration to the event, please use Resino’s company code 71V84 when registering through the following link:

http://pelv.hcpe.2021.nvytes.co/pelvhcpe21/register/71V84.html

Attendees can find Resino at booth number 7815, where they can get answers to questions right on the spot and learn how Resino may support them to drive business forward.

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